Part Number Hot Search : 
2864A 090130 DB103 C3835 IN5396G U4SBA20 ETC5064N IRFP150
Product Description
Full Text Search
 

To Download IXZ4DF18N50 Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 IXZ4DF18N50
RF Power MOSFET & DRIVER
Driver / MOSFET Combination DEIC-515 Driver combined with IXZ318N50 MOSFET Gate driver matched to MOSFET
Features * Isolated substrate - high isolation voltage (>2500V) - excellent thermal transfer - Increased temperature and power cycling capability * IXYS advanced Z-MOS process * Low Rds(ON) * Very low insertion inductance(<2nH) * No beryllium oxide (BeO) or other hazardous materials * Built using the advantages and compatibility of CMOS and IXYS HDMOSTM processes * Latch-up protected * Low quiescent supply current Applications Advantages * Optimized for RF and high speed * Easy to mount--no insulators needed * High power density * Single package reduces size and heat sink area * Class D or E Switching Amplifier * Multi MHz Switch Mode Power Supplies (SMPS) 500 Volts 19 A 0.29 Ohms
Description The IXZ4DF18N50 is a CMOS high speed high current gate driver and ZMOS MOSFET combination specifically designed Class D and E HF RF applications at up to 40MHz, as well as other applications. The IXZ4DF18N50 in pulse mode can provide 95A of peak current while producing voltage rise and fall times of less than 4ns, and minimum pulse widths of 8ns. The input of the driver is fully immune to latch up over the entire operating range. Designed with small internal delays, the IXZ4DF18N50 is suitable for higher power operation where combiners are used. Its features and wide safety margin in operating voltage and power make the IXZ4DF18N50 unmatched in performance and value. The IXZ4DF18N50 is packaged in DEI's low inductance RF package incorporating DEI's RF layout techniques to minimize stray lead inductances for optimum switching performance. The IXZ4DF18N50 is a surfacemountable device. Figure 1. Functional Diagram
IXZ4DF18N50
RF Power MOSFET & DRIVER
Device Specifications
Parameter
Maximum Junction Temperature Operating Temperature Range Weight
Value 150C - 40C to 85C 5.5g Test Conditions ID = 0.5IDM25 Maximum Ratings 40MHz 500V 20V 50uA 1mA 19A 95A 19A 500 W 0.25 C/W TBD C/W Test Condition Minimum Typical 0.29 8V - 5V
VCCIN -2V
Symbol fMAX VDSS VCC, VCCIN IDSS IDM25 IDM IAR PT (MOSFET and Driver) RthJC RthJHS
Device Performance
VDS = 0.8VDSS VGS = 0V
TJ = 25C TJ = 125C
TC = 25C TC = 25C, Pulse limited by TJM TC = 25C TC
= 25C
Symbol Rds(ON) VCC, VCCIN IN (Signal Input) VIH (High Input Voltage) VIL (Low Input Voltage) ZIN Cstray COSS tONDLY tOFFDLY tR tF
Maximum
VCC = 15 V, ID = 0.5IDM25 Pulse Test, t 300 S, Duty Cycle 2%
15V
20V VCCIN+0.3V VCCIN+0.3V
0.8V
f = 1MHz
f = 1MHz Any one pin to the back plane metal
7960 46pf 139pf 17 nS 26 nS 3 nS 3 nS
VGS = 0V, VDS = 0.8VDSS(max) , f =1MHz
TC = 25C VCC, VCCIN, VIN = 15V, 1 S Pulse, VDS = 50V, RL = 5.0
TC = 25C VCC, VCCIN, VIN = 15V,1 S Pulse, VDS = 50V, RL = 5.0
IXZ4DF18N50
RF Power MOSFET & DRIVER
Fig. 2 Fig. 3 R DS(ON) vs. Temperature ID = 0.5 IDM
0.7 0.65 0.6 0.55 0.5 0.45 0.4 0.35 0.3 0.25 0.2 20 70 120 170
Extended Output Characteristics @ 25C
90 80 70 60 50 40 30 20 10 0 0 25 50 V DS (V) 75 100 125 ID (A) V GS = 20V V GS = 15V V GS = 8V
R DS(ON)
Temperature C
Fig. 4
Propagation Delay ON vs. Supply Voltage ID = 0.5 IDM
24 23
Fig. 5
Propagation Delay OFF vs. Supply Voltage ID= 0.5 IDM
26.5
Time (nS)
20 19 18 17 16 15 5 10 15 20 25
Time (nS)
22 21
26
25.5 5 10 15 20 25
VCC / VCCIN / IN (V)
Fig. 6
18.5 18
VCC / VCCIN / IN (V)
Propagation Delay OFF vs. Temperature ID = 0.5 IDM, VCC / VCCIN / IN =15V
Propagation Delay ON vs. Temperature ID= 0.5 IDM, VCC / VCCIN / IN = 15V
Fig. 7
30 29
Time (nS)
Time (nS)
17.5 17 16.5 16 20 70 120 170
28 27 26 25 20 70 120 170
Temperature C
Temperature C
IXZ4DF18N50
RF Power MOSFET & DRIVER
Fig. 8
Rise Time vs. Supply Voltage ID = 0.5 IDM
4
Fig. 9
12 10
Fall Time vs. Supply Voltage ID = 0.5 IDM
3.5
Time (nS)
Time (nS)
8 6 4 2
3
2.5
0
2 5 10 15 20 25
5
10
15
20
25
VCC / VCCIN / IN (V)
Fig. 10
3
VCC / VCCIN / IN (V)
Fig. 11
3
Rise Time vs. Temperature ID = 0.5 IDM , VCC / VCCIN / IN = 15V
Fall Time vs. Temperature ID = 0.5 IDM, VCC / VCCIN / IN = 15V
2.5
Time (nS)
2
Time (nS)
20 70 120 170
2.5
2
1.5
1
1.5 20 70 120 170
Temperature C
Temperature C
Fig. 12
O u tp u t C a p a c ita n c e vs . V D S Vo lta g e
Fig. 13
10
VCC Supply Current vs. Frequency Driver Section
20V 15V 8V
10000
Capacitance (pF)
1000
VCC Current (A)
100
C O SS
1
10
0.1
1 0 100 200 300 400 500
0.01 0 10 20 30 40 50
V D S (V)
Frequency (MHz)
IXZ4DF18N50
RF Power MOSFET & DRIVER
Fig. 14
VCCIN Supply Current vs. Frequency Driver Section
10 20V 15V 8V 0.1
VCCIN Current (A)
1
0.01
0.001 0 10 20 30 40 50
Frequency (MHz)
Test Circuit
Fig. 15
VDD 4.7UF VCC 4.7UF + + 0.01u 0.01u 0.01u 0.01u 0.47u 0.47u
10UF 100V
+
VCC Source DGND INVCC
IN
L1 VCC CM Choke
IN Drain INGND
5 ohm 20W 1
DGND VCC
4.7UF + + 0.01u 0.01u 0.01u 0.01u
Source
2
.01uF
4.7UF
0.47u
0.47u
Place all capacitors on VCC as close to the VCC lead as possible
IXZ4DF18N50
RF Power MOSFET & DRIVER
Lead Description
SYMBOL Drain Source VCC FUNCTION MOSFET Drain Drain of Power MOSFET. MOSFET Source DESCRIPTION
Source of Power MOSFET. This connection is common to DGND.
Power supply input for the driver output section. These leads provide power to the output Driver Section section of the DEIC515 driver. Both leads must be connected. Supply Voltage Input for the positive input section power-supply voltage. This lead provide power to the inInput Section put section of the DEIC515 driver. This lead should not be directly connected to VCC. Supply Voltage Input Power Driver Ground Input Section Ground Input signal. The system ground leads. Internally connected to all circuitry, these leads provide ground reference for the entire chip. These leads should be connected to a low noise analog ground plane for optimum performance. The input section ground lead. This lead is a Kelvin connection internally connected to DGND. This lead must not be connected to DGND as excessive current can damage this lead.
VCCIN IN DGND
INGND
IXYS RF reserves the right to change limits, test conditions and dimensions without notice. IXYS RF MOSFETS are covered by one or more of the following U.S. patents:
4,835,592 5,034,796 5,381,025 6,731,002
4,860,072 5,049,961 5,640,045
4,881,106 5,063,307 6,404,065
4,891,686 5,187,117 6,583,505
4,931,844 5,237,481 6,710,463
5,017,508 5,486,715 6,727,585
IXZ4DF18N50
RF Power MOSFET & DRIVER
Fig. 16 IXZ4DF18N50 Package Outline
IXYS RF An IXYS Company 2401 Research Blvd. Ste. 108, Ft. Collins, CO 80526 Tel: 970-493-1901; Fax: 970-493-1903 e-mail: deiinfo@directedenergy.com www.directedenergy.com


▲Up To Search▲   

 
Price & Availability of IXZ4DF18N50

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X